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HK Haoli Electronics

Product Details
  • image of Microprocessors>R9A08G045S15GBG#AC0
  • image of Microprocessors>R9A08G045S15GBG#AC0
Model R9A08G045S15GBG#AC0
Product Category Microprocessors
Manufacturer Intersil (Renesas Electronics Corporation)
Description SOC RZ/G3S 13BG
Encapsulation -
Package Tray
RoHS Status 1
Price: $15.3300
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image of Microprocessors>22170567
22170567
Model
22170567
Product Category
Microprocessors
Manufacturer
Intersil (Renesas Electronics Corporation)
Description
SOC RZ/G3S 13BG
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrIntersil (Renesas Electronics Corporation)
SeriesRZ/G3S
PackageTray
Product StatusACTIVE
Package / Case361-LFBGA
Mounting TypeSurface Mount
Speed1.1GHz
Operating Temperature-40°C ~ 85°C (TA)
Core ProcessorARM® Cortex®-A55
Voltage - I/O1.8V, 3.3V
Supplier Device Package361-LFBGA (13x13)
Ethernet10/100/1000Mbps (2)
USBUSB 2.0 OTG (2)
Number of Cores/Bus Width1 Core, 64-Bit
Co-Processors/DSPARM® Cortex®-M33
RAM ControllersDDR4, LPDDR4
Graphics AccelerationNo
Security FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Additional InterfacesDMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
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