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HK Haoli Electronics

Product Details
  • image of System On Chip (SoC)>AGIB022R31A1I2V
  • image of System On Chip (SoC)>AGIB022R31A1I2V
Model AGIB022R31A1I2V
Product Category System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation -
Package Tray
RoHS Status
Price: $38,479.2600
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image of System On Chip (SoC)>22031432
22031432
Model
22031432
Product Category
System On Chip (SoC)
Manufacturer
Intel
Description
IC
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex I
PackageTray
Product StatusACTIVE
Package / Case3184-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.2M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package3184-BGA (56x45)
ArchitectureMPU, FPGA
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