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HK Haoli Electronics

Product Details
  • image of System On Chip (SoC)>AGFD019R24C2E2V
  • image of System On Chip (SoC)>AGFD019R24C2E2V
Model AGFD019R24C2E2V
Product Category System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation -
Package Tray
RoHS Status
Price: $18,614.0100
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image of System On Chip (SoC)>22031507
22031507
Model
22031507
Product Category
System On Chip (SoC)
Manufacturer
Intel
Description
IC
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 1.9M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA
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