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HK Haoli Electronics

Product Details
  • image of System On Chip (SoC)>A5EC065BB23AE4SR0
  • image of System On Chip (SoC)>A5EC065BB23AE4SR0
Model A5EC065BB23AE4SR0
Product Category System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation -
Package Tray
RoHS Status
Price: $1,048.9600
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image of System On Chip (SoC)>22031415
22031415
Model
22031415
Product Category
System On Chip (SoC)
Manufacturer
Intel
Description
IC
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex E
PackageTray
Product StatusACTIVE
Package / Case839-FBGA
Speed1.5GHz, 1.8GHz
RAM Size512kB
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary AttributesFPGA - 656K Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe, WDT
Supplier Device Package839-VPBGA (23x23)
ArchitectureMPU, FPGA
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