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HK Haoli Electronics

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>100-1221-3
  • image of Microcontrollers, Microprocessor, FPGA Modules>100-1221-3
Model 100-1221-3
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Becom Electronics
Description IC MOD CM-BF537
Encapsulation -
Package Box
RoHS Status 1
Price: $318.9400
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image of Microcontrollers, Microprocessor, FPGA Modules>2346765
2346765
Model
2346765
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Becom Electronics
Description
IC MOD CM-BF537
Encapsulation
-
Package
Box
lang_roHSStatusStatus
1
Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
MfrBecom Electronics
SeriesBlackfin®
PackageBox
Product StatusACTIVE
Connector TypeExpansion 2 x 60
Size / Dimension1.440" L x 1.240" W (36.50mm x 31.50mm)
Speed600MHz
RAM Size32MB
Operating Temperature0°C ~ 70°C
Module/Board TypeMPU Core
Core ProcessorCM-BF537
Flash Size4MB
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